HAD810全自動平面固晶機

HAD810（全自動平面固晶機）

（週期： 220ms）

適用於IC類框架

一、機型特性

1.直線電機驅動的雙點膠系統；

2.高精度直線驅動固晶綁頭,音圈扭力環精確控制固晶壓力；

3.高精度搜尋芯片平臺，伺服電機驅動芯片角度矯正系統，配備自動擴膜系統；

4.採用點膠獨立控制系統，膠量控制更加精確；

5.採用真空漏晶檢測；

6.工控機控制設備運行，簡化了自動化設備的操作；

7.精準的自動化設備爲企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

HAD810

Automatic Plane-type Die Bonder

Cycle: 220ms

It is compatible with IC frame

1.        Linear motor is applied to drive double adhesive dispensing bond head;

2.        High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;

4.        A separate dispensing control system is adopted to make a precisely control of dispensing amount;

5.        Vacuum die missing testing technology is adopted;

6.        IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.