HAD812全自動半導體平面式高速固晶機

HAD812（全自動半導體平面式高速固晶機）

（週期： 250ms）

適用於IC類框架

一、機型特性

1.   直線電機驅動的雙點膠系統；

2.   高精度直線驅動固晶綁頭,音圈扭力環精確控制固晶壓力；

3.   高精度搜尋芯片平臺，伺服電機驅動芯片角度矯正系統，配備12寸晶圓自動擴膜系統；

4.   採用點膠獨立控制系統，膠量控制更加精確；

5.   採用真空漏晶檢測；

6.   工控機控制設備運行，簡化了自動化設備的操作；

7.精準的自動化設備爲企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

HAD812

Automatic Plane-type Die Bonder

Cycle: 250ms

It is compatible with IC frame

1.        Linear motor is applied to drive double dispensing system.

2.        High precision linear motor drive die bonder, voice coil torsion loop controls die bond pressure accurately.

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with 12-inch wafer automatic film expansion system.

4.        A separate dispensing control system is adopted to make a precise control of dispensing amount.

5.        Vacuum die missing testing technology is adopted.

6.        IPC control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.