HAD816-A全自動高速固晶機

HAD816-A（全自動高速固晶機）

（週期： 120ms）

適合於矩陣式沾膠工藝的IC支架，如DFN/QFN系列、SOP系列

一、機型特性

1.採用國際領先的單邦雙臂固晶，可程式恆溫雙沾膠，晶片搜尋系統；

2.自主研發視覺系統&工控機控制系統，簡化了自動化設備的操作,簡單易操作&維護；

3.材料/產品的自動載入載出，疊料方式吸支架上料具備吸紙功能，料盒載出，有效提高了生產效率；

4.採用絲桿伺服驅動搜尋晶片平臺（X/Y）與線性電機驅動送料平臺（B/C）；

5.採用晶框自動校正晶片結構以及自動擴藍膜結構，兼容8寸和6寸晶圓；

6.單邦雙臂固晶bondforce參數化調整，流量式芯片真空檢漏晶測，穩定可靠；

7.可程式恆溫雙沾膠模組，效率大幅提升，膠點精度和一致性高；

8.固晶位置精準及優良的一致性，高品質產品的保證；

9.節拍：120毫秒/點，實際產出取決於芯片尺寸和支架上產品的密集度；

10.進收料採用外掛模式，可多臺設備聯機生產。

HAD816-A（Automatic High-speed Die Bonder）

（Cycle: 120ms）

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.

Model Features

1. International leading single die bonder and double swing arms, with programmable constant temperature double adhesive, and chip searching system.

2. Independently developed visual system & industrial computer control system, simplifying the operation of automatic equipment, easy to operate & maintain.

3. Automatic loading and unloading of materials/products, the loading of stacking material suction leadframe has the function of paper suction, and magazine unloading, effectively improving the production efficiency.

4. Screw servo drive is adopted to drive chip searching platform (X/Y) and linear motor is adopted to drive feeding platform (B/C).

5. Automatic frame-correcting wafer structure and automatic blue-expanding membrane structure, compatible with 8-inch and 6-inch wafers.

6. Single die bonder and double swing arms, bondforce parameter adjustment, flow-type chip vacuum leaking detection crystal measurement, stable and reliable.

7. Programmable constant temperature double adhesive module, greatly improving efficiency, glue point accuracy and consistency.

8. Precise location and good consistency of die bonding, guarantee of high quality.

9. Beat: 120 ms/point. Actual output depends on chip size and the density of products on the leadframe.

10. The material incoming and receiving adopt plug-in mode, and multiple equipments can be operated online.