HAD816-B全自動高速固晶機

HAD816-B（全自動高速固晶機）

（週期： 120ms）

適合於矩陣式粘膠工藝的IC支架，如DFN/QFN系列、SOP系列

一、機型特性

1.點膠模組可擴展性適應客戶支架；高達4組點膠針頭，大大提高了點膠效率，每組點膠機構X/Y/Z向可調整方便調試維護；

2.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）；

3.wafer table自動校正芯片位置；

4.自主研發工控機控制系統，簡單易操作&維護；

5.流量式芯片真空檢測，穩定可靠；

6.自主研發視覺系統for pre-bond/pos-bond，穩定可靠；

7.材料/產品的全自動載入載出，高生產效率的保證；

8.固晶位置精準及優良的一致性，高品質產品的保證；

9.節拍：120毫秒/點，實際產出取決於芯片尺寸和支架上產品的密集度；

10.bondforce參數化調整，穩定可靠。

HAD816-B（Automatic High-speed Die Bonder）

（Cycle: 120ms）

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.

Model Features

1. The dispensing module is expandable to adapt to customer support; up to 4 sets of dispensing needles, greatly improving the efficiency of dispensing. The Dispensing mechanism of each set can be adjusted in X/Y/Z direction for convenient debugging and maintenance.

2. Using linear motor to drive the search chip platform (X/Y) and the feeding platform (B/C);

3. Wafer table automatically corrects the position of the chip;

4. Independently developed industrial computer control system, easy to operate and maintain;

5. Flow type chip vacuum detection, stable and reliable;

6. Independently developed visual system for pre-bond/ pos-bond, stable and reliable;

7. Fully automatic loading and unloading of materials/products, ensuring high production efficiency;

8. Precise location of die bonding and excellent consistency, guarantee high quality products;

9. Beat: 120 ms/point, actual output depends on chip size and density of products on the bracket;

10. Bondforce parameterized adjustment, stable and reliable.