GT836M平面式高速固晶機

GT836M（平面式高速固晶機）

（週期：180ms）

適用於數碼、點陣、大功率、COB、SMD等

一、機型特性

1.平面式LED燈全自動固晶的最佳選擇；

2.高速固晶（180ms/顆，每小時產量爲20K）、精準的自動化設備爲企業提高生產效率、降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

3. 精準的固晶位置及優良的一致性爲後道工序提供了先天的保障；

4.採用直驅電機驅動邦頭；

5.採用全新接觸式探測系統控制擺臂，有效解決了PCB板或支架高度不一致而導致的固晶問題；

6.採用線性電機驅動晶片搜尋平臺（X/Y）與固晶平臺（B/C）

7.採用可程式恆溫點膠系統；

8.採用真空漏晶檢測；

9. 工控機控制設備運行，簡化了自動化設備的操作；

GT836M

Plane-type High-speed Die Bonder

Cycle: 180ms

It is compatible with digital products, dot matrix, high power, COB, and SMD etc.

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Linear motor is applied to drive bond head;

5.        New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

6.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.        Programmed control constant-temperature adhesive dispensing system is also applied;

8.        Vacuum die missing testing technology is adopted;

9.        IPC will control the operation of equipment, simplifying the operation of automation equipment.