GTS100BH-N（平面式高速固晶機）
（週期：50ms）
適用於SMD020，1010，2121，2835，燈絲，COB等
一、機型特性
1.採用國際領先的雙固晶，雙點膠，雙晶片搜尋系統；
2.採用直驅電機驅動邦頭
3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）
4.採用可程式恆溫點膠系統；
5.採用真空漏晶檢測；
6.採用自動式上下料系統，減少換料時間；
7. 工控機控制設備運行，簡化了自動化設備的操作；
8.精準的自動化設備爲企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
9. 精準的固晶位置及優良的一致性爲後道工序提供了先天的保障。
GTS100BH-N
Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.
Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system is applied to saving the time of reloading;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
