GTS100BH-PA平面式高速固晶機

GTS100BH-PA（平面式高速固晶機）

（週期：50ms）

適用於SMD020，1010，2121，2835，燈絲，COB等

一、機型特性

1.採用國際領先的雙固晶，雙點膠，雙晶片搜尋系統；

2.採用直驅電機驅動邦頭；

3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）；

4.晶框採用自動角度修正系統；

5.採用可程式恆溫點膠系統；

6.採用真空漏晶檢測；

7.採用自動式上下料系統，減少換料時間；

8.採用自動裝卸晶環系統，有效提高了生產效率；

9.工控機控制設備運行，簡化了自動化設備的操作；

10.精準的自動化設備爲企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

11. 精準的固晶位置及優良的一致性爲後道工序提供了先天的保障。

GTS100BH-PA

Plane-type High-speed Die Bonder

Cycle: 50ms

It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.

Product Features

1.      International leading double die bond, double adhesive dispense and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied;

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Automatic loading and unloading system is applied to saving the time of reloading;

8.      Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;

9.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

10.   Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

11.   Precise die bond location and excellent compatibility will guarantee the back-end processing.