HAD8606-H六頭平面式高速固晶機

HAD8606-H（六頭平面式高速固晶機）

（單頭週期：135ms）

適用於Mini LED PCB

一、機型特性

1.採用國際領先的六邦頭固晶，六個晶片搜尋系統；三個固晶平臺內部直接連線，同一基板同時一次性完成三種芯片固晶；

2.採用直驅伺服電機驅動邦頭；

3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）；

4.夾具平臺底部採用吸真空方式，PCB在真空的作用下達到固晶平面高度一致，提高固晶速度及固晶質量；

5.採用真空漏晶檢測；

6.採用自動式上下料，兩種方式兼容進料（料盒進料，接駁臺進料），以及料盒收料和接駁臺接下一臺設備兩種方式兼容收料，很大程度提高了生產效率；

7.芯片平臺增加自動換環功能，可以自動修正芯片角度；

8.工控機控制設備運行，簡化了自動化設備的操作；

9.精準的設備化設備爲企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

10. 精準的固晶位置及優良的一致性爲後道工序提供了先天的保障。

HAD8606-H

Sextuple-head Plane-type High-speed Die Bonder

Single-head Cycle: 135ms

It is compatible with Mini LED PCB

Product Features

1.      International leading sextuple die bond, sextuple adhesive dispense and double die searching system; direct-wiring inside three die bond platforms, bonding three kinds of dies all at once on the substrate;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Vacuum picking method is adopted on the clamp base, uniformizing the bonding height of PCB to expedite the bonding and ensure the bonding quality simultaneously;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system, two ways of loading(by magazine or conveyor ) and receiving by magazine or the conveyor which connected to another machine, improving the production efficiency largely;

7.      Adding automatic ring changing function on the die platform, correcting the die theta automatically;

8.      IPC will control the operation of equipment, simplifying the usage of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;