HAD8630P
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產品詳情
1.採用國際領先的雙邦四臂取固晶系統，具備搜尋系統，1個固晶平臺 2.採用中空伺服馬達搭配音圈電機驅動邦頭旋轉和上下 3.採用線性電機驅動搜尋晶片平臺（X/Y），採用伺服和絲桿結構驅動送料平臺（B/C），提高工作臺定位時間 4.夾具平臺底部採用吸真空方式，PCB在真空的作用下達到固晶平面高度一致，提高固晶速度及固晶質量 5.採用真空漏晶檢測 6.採用左進右出流水線接駁臺試自動上下料，方便機臺連線 7.芯片平臺增加自動換環功能，可以自動修正芯片角度 8.工控機控制設備運行，簡化了自動化設備的操作 9.可移動修正的頂針結構，與雙擺臂中心位時時吻合 10.芯片底部飛拍功能保證了固晶精度 HAD8630P model features: 1. Adopt the internationally leading dual-state four-arm chip taking system, with search system, 1 chip bonding platform 2. Use hollow servo motor with voice coil motor to drive the head to rotate and up and down 3. Use linear motor to drive the search wafer platform (X/Y), and use servo and screw structure to drive the feeding platform (B/C) to improve the positioning time of the workbench 4. The bottom of the fixture platform adopts the vacuum suction method, and the PCB achieves the same height of the bonding plane under the action of vacuum, which improves the bonding speed and quality of the bonding. 5. Using vacuum leakage detection 6. Use the left-in and right-out assembly line to connect to the platform to test automatic loading and unloading, which is convenient for machine connection 7. The chip platform adds automatic ring change function, which can automatically correct the chip angle 8. The industrial computer controls the operation of the equipment, which simplifies the operation of the automation equipment 9. Movable and revised thimble structure, consistent with the center position of the double swing arm from time to time 10. The flying shot function at the bottom of the chip ensures the precision of die bonding |
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